Semi-Automatic Pulsed Heat Bonder using a Common Carrier System.
The BS-02 is a pulsed heat semi automatic bonder with multiple bonding heads that will provide simultaneous bonding along a single line in the x-axis. It can be configured with 2 to 5 bonding heads; which can be added or removed according to customer needs. Multiple heads increase throughput, while only marginally increasing equipment size and cost. Units in this line, inlcuding the BS-01, use a common carrier to improve throughput and reduce cost.