CN-03 Automatic COG Bonding System

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Laminate ACF, Mount IC, & Perform ACF Final Bonding

The CN-03 is an automated system that completely assembles COG devices. The operator loads displays on a conveyor, and the CN-03 laminates ACF, mounts Ics, and completes the bond automatically. Ideal solution for COG applications using 1 to 5 inch panels. The CN-03 is equipped with 2 IC tray stages, so trays can be loaded without stopping production. Also, conveyer loading and unloading of LCDs allows for continuous operation and very high productivity.

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Last modified on Saturday, 23 April 2011 08:47