A low cost ACF aligner-bonder for medium and high volume applications
The Ito Group TTAB-1008CR/2525AR is a tabletop ACF (anisotropic conductive film) aligner-bonder featuring a rotary table for improved throughput. It is available in both constant heat and ActiveHeatTM configurations and features a unique stage support mechanism which improves coplanarity and allows the machine to be used with complex 3D structures such as camera modules. The TTAB-1008CR/2525AR is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. The device can range from a simple flexible printed circuit to a complete display assembly or camera module. After alignment has been completed, the operator presses the START buttons and the machine stage rotates so that the aligned assembly can be bonded while a second assembly is prepared. Load, unload, and alignment are all performed by the operator. The TTAB-1008CR/2525AR is recommended for use in FOG, FOB, and FOF assembly and has a recommended minimum pitch of 0.2mm when using a 0.1/0.1mm line/space configuration.
- Highly-responsive PID controllers for temperature control.
- Precision air cylinder with digital pressure regulator for fine pressure control.
- Rotary stage for high throughput and efficiency (TYP 300UPH).
- Designed for rapid tooling changeover.
- Floating CarrierTM capable.
- Comprehensive native English manual covering set-up, process development, maintenance, and operation. Other languages (Japanese, Chinese, Vietnamese, etc.) available upon request.
|Heating Method||Constant Heat||Ceramic ActiveHeat™|
|Heat Tool Size||Length: 5-100mm – Width: 1-8mm||Length: 5-25mm – Width: 1-25mm|
|Power||AC100 – 240V, Single Phase|
|Product Size Range||W100mm x L150mm (Center Bonding Position)|
|Substrate Stage||2 Interchangeable Stages – Max W100 x D120mm|
|Device Stage||2 Interchangeable Stages – Max W150 x D100mm|
Full specifications are available for download through the link below. The Ito TTAB 1008CR/2525AR is a tabletop aligner-bonder with rotary stage to improve throughput. It is available in both constant Heat and ActiveHeat configurations and features a unique stage support mechanism which allows the machine to be used with complex 3D structures such as camera modules.