ACF Flip Chip Mounter with Automatic Alignment System
The MS-01 is a semi-automatic Flip Chip Mounter with automatic alignment. The substrate is loaded in the unit and multiple chips can be mounted in an array, either on the same or across multiple substrates. From the lab to the production line, the MS-01 is an ideal solution for COG applications using 1 to 5 inch panels. The MS-01 supports both COG (Chip-on-Glass) and COF (Chip-on-Flex) applications with minimal changeover.