COG ACF Lamination and Flip Chip Mounting
An ideal solution for COG applications using 1 to 5 inch panels, the CN-01 is a semi-automatic line that laminates ACF to the display and then mounts one or more ICs for ACF bonding at a later stage. The operator loads & unloads the displays on conveyors. The conveyer loading and unloading of LCDs allows for continuous operation and very high productivity. The CN-01 is versatile enough to laminate two ACF locations and mount two different ICs on one display.