Full Auto ACF Lamination, Auto Alignment Pre Bonding, Main Bonding
The FAS-7100 is a full-auto ACF bonder for devices such as mobile phones. Devices are bonded onto FPCs or PCBs using ACF. This integrated line consists of an ACF Laminator, two Feeders, a Mounter, and a Bonder. The system utilizes carriers similar to SMT pallets; which the substrates are held in during and after the process. Also a carrier recirculation option is available if desired. Each unit of the FAS-7100 uses proven mechanical designs in order to provide the highest level of stability & bond quality. Line units can be configured in any order or sequence required to match the assmbly requirements.