Semiautomatic ACF Equipment

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Ohashi’s semiautomatic equipment is used worldwide to build smart phones, music players, medical devices, camera modules, and a wide range of other products. It offers best-in-class performance both in quality and price. The video on the right is an overview of how we implement our semiautomatic lines, and detailed information on the various pieces of equipment is available below.

 

 
Semi-Automatic Constant Heat Bonder using a Common Carrier System. The BS-01 is a constant heat semi automatic bonder with multiple bonding heads that will provide simultaneous bonding along a single…
 
 
 
 
 
 
 

 
Semi-Automatic Pulsed Heat Bonder using a Common Carrier System. The BS-02 is a pulsed heat semi automatic bonder with multiple bonding heads that will provide simultaneous bonding along a single…
 
 
 
 
 
 
 

 
Semi-Auto ACF Laminator using a Common Carrier System. The LS-01 is a carrier based semi-automatic ACF lamination unit that can laminate multiple sites within an array area of 250x400mm. The…
 
 
 
 
 
 
 

 
ACF Flip Chip Mounter with Automatic Alignment System The MS-01 is a semi-automatic Flip Chip Mounter with automatic alignment. The substrate is loaded in the unit and multiple chips can…
 
 
 
 
 
 
 

 
ACF Flip Chip Mounter with Automatic Alignment System. The MS-02 is a semi-automatic Flip Chip Mounter with automatic alignment. The substrate is loaded in the unit and multiple chips can…
 
 
 
 
 
 
 

 
FPC Mounter using a Common Carrier System The MS-03 is a semi-auto FPC mounter with automatic alignment. It is capable of placing multiple FPCs in an XY array within the…
 
 
 
 
 
 
 

 
COG ACF Lamination and Flip Chip Mounting An ideal solution for COG applications using 1 to 5 inch panels, the CN-01 is a semi-automatic line that laminates ACF to the…
 
 
 
 
 
 
 

 
High-precision FPC Mounter/Bonder with Auto-Alignment The ME-01 is a semi-automatic FPC mounter/bonder designed for applications requiring high precision and reliability, such as medical devices. The operator loads a substrate, after…