Test IC for ACF COG Bonding

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This IC was designed to allow testing or process development for COG ACF bonding.

  • Designed specifically for ACF COG bonding.
  • Matching glass coupons are available.
  • Designed for easy testing of contact resistance, isolation, and sheer strength.
  • Available in low quantities.
  • No NRE.
  • In stock.

 

For a full specifiation sheet and other information, please use the download link below.

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