Ito Group Tabletop ACF Aligner-Bonder With Rotary Stage

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Ito America, Ito China, Ito Europe, Ito India, Ito Japan, Ito Thailand, Ito Vietnam

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    A low cost ACF aligner-bonder for medium and high volume applications

    The Ito Group TTAB-1008CR/2525AR is a tabletop ACF (anisotropic conductive film) aligner-bonder featuring a rotary table for improved throughput. It is available in both constant heat and ActiveHeatTM configurations and features a unique stage support mechanism which improves coplanarity and allows the machine to be used with complex 3D structures such as camera modules.

    The TTAB-1008CR/2525AR is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. The device can range from a simple flexible printed circuit to a complete display assembly or camera module. After alignment has been completed, the operator presses the START buttons and the machine stage rotates so that the aligned assembly can be bonded while a second assembly is prepared. Load, unload, and alignment are all performed by the operator.

    The TTAB-1008CR/2525AR is recommended for use in FOG, FOB, and FOF assembly and has a recommended minimum pitch of 0.2mm when using a 0.1/0.1mm line/space configuration.

    Additional Features:

    • Highly-responsive PID controllers for temperature control.
    • Precision air cylinder with digital pressure regulator for fine pressure control.
    • Rotary stage for high throughput and efficiency (TYP 300UPH).
    • Designed for rapid tooling changeover.
    • Floating CarrierTM capable.
    • Comprehensive native English manual covering set-up, process development, maintenance, and operation. Other languages (Japanese, Chinese, Vietnamese, etc.) available upon request.

    General Specifications:

    TTAB-1008CR TTAB-2525AR
    Heating Method Constant Heat Ceramic ActiveHeat™
    Heat Tool Size Length: 5-100mm – Width: 1-8mm Length: 5-25mm – Width: 1-25mm
    Power AC100 – 240V, Single Phase
    Product Size Range W100mm x L150mm (Center Bonding Position)
    Substrate Stage 2 Interchangeable Stages – Max W100 x D120mm
    Device Stage 2 Interchangeable Stages – Max W150 x D100mm

    Full specifications are available for download through the link below. The Ito TTAB 1008CR/2525AR is a tabletop aligner-bonder with rotary stage to improve throughput. It is available in both constant Heat and ActiveHeat configurations and features a unique stage support mechanism
    which allows the machine to be used with complex 3D structures such as camera modules.

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