Semi-Automatic Pulsed Heat ACF Bonder using a Common Carrier System.

The BS-03/4 is a pulsed heat semi automatic bonder with multiple bonding heads that will provide simultaneous bonding along a single line in the x-axis. It can be configured with 2 to 5 bonding heads; which can be added or removed according to customer needs. Multiple heads increase throughput, while only marginally increasing equipment size and cost. Units in this line, including the BS-01/02, use a common carrier to improve throughput and reduce cost.