The correct selection of interposer is critical to maintaining a high quality and cost-effective ACF assembly process.

Shin-Etsu manufacturers several silicone materials that can be used as bonding interposers with ACF or ACP. These materials feature good heat conductivity, the right hardness, a low-stick surface, and will not contaminate the bond or the bond area. Ito Group can help you select the right material for your application and then provide it in the thickness and width you require. Our slitting operation allows us to rapidly and cost-effectively provide you with only the width you need, reducing waste and lowering cost.