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- Required Floor Space: 4.08 ㎡
- High productivity in a compact footprint (Maximum 1340UPH)
- Improved Placement Accuracy through high-resolution camera with fixed-positioned mounting head mechanism
- Flexible Temperature Control (10-step adjustable)
- Adopts “DFCF” Head for real-time monitoring of bonding force, bonding head position & bonding head speed
- Easy Changeover (carrier transfer system, detachable bonding tool)
- Integration Possible with loader, unloader, atmospheric Plasma cleaning system, etc
